#Advanced Packaging

4 articles with this tag

AI supercycle Enters Year One of a Ten-Year Run
Technology

AI supercycle Enters Year One of a Ten-Year Run

Chip suppliers in Taiwan say AI demand is year one of a ten-year run, led by Phison, TSMC and GBTC.

about 1 month ago
Lam Research CEO on AI Demand & Semiconductor Innovation
Semiconductors

Lam Research CEO on AI Demand & Semiconductor Innovation

Lam Research CEO Tim Archer discusses the surge in AI-driven chip demand and the company's $3B investment in R&D labs to meet the growing need for advanced manufacturing processes.

about 2 months ago
AMD Invests $10B in Taiwan for AI
Semiconductors

AMD Invests $10B in Taiwan for AI

AMD pledges over $10 billion to Taiwan's tech sector, aiming to accelerate AI infrastructure development through advanced packaging and strategic partnerships.

5 months ago
AI Chip Bottleneck: Advanced Packaging Demands Accelerate
Semiconductors

AI Chip Bottleneck: Advanced Packaging Demands Accelerate

The race for AI supremacy hinges on advanced packaging, a critical bottleneck TSMC, Intel, and Samsung are addressing with new technologies and expanded capacity.

6 months ago