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Principal Packaging Engineer

Velaura AI

Santa Clara, CA, USFull-timePlatform
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Posted July 15, 2026

Role Overview

We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura’s next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.

Role Overview

We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura’s next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.
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Listing aggregated by StartupHub.ai from Velaura AI’s public careers board. Applications are handled on the employer’s site.